Method of producing a semiconductor device

ABSTRACT

A semiconductor device includes an InP substrate, an intrinsic InGaAs channel layer formed on the InP substrate and lattice matched to the InP substrate, a doped GaAsSb carrier supply layer formed on the intrinsic InGaAs channel layer and lattice matched to the InP substrate, a gate electrode formed on the doped GaAsSb carrier supply layer, and a source electrode and a drain electrode which are respectively formed on the doped GaAsSb carrier supply layer and located on both sides of the gate electrode.

This application is a division of application Ser. No. 07/521,404, filedMay 10, 1990, allowed and still pending.

BACKGROUND OF THE INVENTION

The present invention generally relates to semiconductor devices andproduction methods thereof, and more particularly to a semiconductordevice having a selectively doped heterostructure and a method ofproducing such a semiconductor device.

Generally, a semiconductor device which can operate at a high speed hasa hetero structure using AlGaAs/GaAs. The GaAs layer functions as achannel layer. But since the carrier mobility within the GaAs layer issmall, the improvement of the characteristics of the semiconductordevice is limited thereby.

A high electron mobility transistor (hereinafter simply referred to as aHEMT) is known as one kind of semiconductor device which can operate ata high speed. In order to improve the carrier mobility in the HEMT, itis conceivable to use an InP substrate and form a heterojunction using acompound semiconductor which has a high carrier mobility compared tothat of GaAs and is lattice matched to the InP substrate. In otherwords, an intrinsic InGaAs layer which is lattice matched to the InPsubstrate is used as the channel layer. Conventionally, AlGaAs is usedfor a carrier supply layer but the characteristic thereof is unstabledue to the charging and discharging carriers caused by the DX center,and in order to avoid this problem, it is conceivable to use an InGaPlayer which is lattice matched to GaAs as the carrier supply layer.

As described above, when the InGaAs channel layer is lattice matched tothe InP substrate, an AlInAs layer or an InP layer may be used as thecarrier supply layer. However, AlInAs includes a DX center and it isknown that it is difficult to generate a Schottky junction with InP. Inother words, a trap is formed by the DX center as shown in FIG. 1 whichshows a band of the AlInAs. In addition, a forbidden band is generatedin the current-voltage characteristic. Moreover, the biggest problem isthat InGaAs, AlInAs or InP which makes the lattice matching with InPcannot be etched by a selective dry etching using a gas mixture of CCl₂F₂ and He as the etching gas. For these reasons, it is impossible toproduce an enhancement/depletion type HEMT which is a basis ofsemiconductor integrated circuit devices.

On the other hand, FIG. 2 shows a band structure of the AlInAs/InGaAsheterojunction when the carrier supply layer is made of AlInAs with animpurity density of 1.5×10¹⁸ cm⁻³. There is a potential difference of0.55 eV between the conduction bands of AlInAs and InGaAs layers, and apotential difference of 0.6 eV between the conduction bands of theAlInAs layer and the gate which form a Schottky junction. In order tomake an enhancement type HEMT in this case, the AlInAs carrier supplylayer must have an extremely small thickness in the order of 70 Å. Butwhen the AlInAs carrier supply layer has such a small thickness, thetwo-dimensional electron gas characteristic of the HEMT is easilydeteriorated by the damage caused by a dry etching. On the other hand,when the impurity density is decreased for the purpose of allowing for athicker AlInAs carrier supply layer, it becomes difficult to obtain anohmic contact and it is difficult to obtain a two-dimensional electrongas channel on the drain side. Therefore, it is impossible make anefficient enhancement/depletion type HEMT due to the band structure ofthe AlInAs/InGaAs heterojunction.

SUMMARY OF THE INVENTION

Accordingly, it is a general object of the present invention to providea novel and useful semiconductor device and production method thereof,in which the problems described above are eliminated.

Another and more specific object of the present invention is to providea semiconductor device comprising an InP substrate, an intrinsic InGaAschannel layer formed on the InP substrate and lattice matched to the InPsubstrate, a doped GaAsSb carrier supply layer formed on the intrinsicInGaAs channel layer and lattice matched to the InP substrate, where thedoped GaAsSb carrier supply layer makes contact with the intrinsicInGaAs channel layer, a gate electrode formed on the doped GaAsSbcarrier supply layer, and a source electrode and a drain electrode whichare respectively formed on the doped GaAsSb carrier supply layer andlocated on both sides of the gate electrode. According to thesemiconductor device of the present invention, it is possible to easilyrealize a high-speed semiconductor device having satisfactorycharacteristics.

Still another object of the present invention is to provide asemiconductor device comprising an InP substrate, an intrinsic InGaAschannel layer formed on the InP substrate and lattice matched to the InPsubstrate, a first doped GaAsSb carrier supply layer formed on theintrinsic InGaAs channel layer and lattice matched to the InP substrate,an etching stopper layer formed on the first doped GaAsSb carrier supplylayer, a second doped GaAsSb carrier supply layer formed on the etchingstopper layer, at least a first gate electrode formed on the seconddoped GaAsSb carrier supply layer, and a first source electrode and afirst drain electrode which are respectively formed on the second dopedGaAsSb carrier supply layer and located on both sides of the first gateelectrode. According to the semiconductor device of the presentinvention, it is possible to easily realize a high-speed semiconductordevice having satisfactory characteristics. In addition, it is possibleto realize enhancement/depletion type high-speed semiconductor devices.

Still another object of the present invention is to provide a method ofproducing a semiconductor device comprising the steps of preparing astacked structure having an InP substrate, an intrinsic channel layerformed on the InP substrate, a first doped GaAsSb carrier supply layerformed on the intrinsic channel layer, an etching stopper layer formedon the first doped GaAsSb carrier supply layer, and a second dopedGaAsSb carrier supply layer formed on the etching stopper layer, formingan isolation region which extends from a surface of the second dopedGaAsSb carrier supply layer to the intrinsic channel layer, theisolation region isolating the semiconductor device into first andsecond device regions, forming first and second source electrodes, firstand second drain electrodes and a first gate electrode on the seconddoped GaAsSb carrier supply layer, the first source electrode, the firstdrain electrode and the first gate electrode being formed in the firstdevice region selectively etching the second doped GaAsSb carrier supplylayer to form an opening which extends from the surface of the seconddoped GaAsSb carrier supply layer to a surface of the etching stopperlayer, the etching stopper layer having an etching rate which is smallcompared to an etching rate of the second doped GaAsSb carrier supplylayer, and forming a second gate electrode on the etching stopper layerwithin the opening, the second source electrode, the second drainelectrode and the second gate electrode being formed in the seconddevice region. According to the method of the present invention, it ispossible to easily realize enhancement/depletion type high-speedsemiconductor devices.

Other objects and further features of the present invention will beapparent from the following detailed description when read inconjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a band of AlInAs;

FIG. 2 shows a band structure of a AlInAs/InGaAs heterojunction;

FIGS. 3 and 4 are cross sectional views of an essential part of asemiconductor device according to the present invention for explainingthe operating principle of the present invention;

FIG. 5 is a cross sectional view showing an essential part of anembodiment of the semiconductor device according to the presentinvention;

FIGS. 6 through 13 and 15 are cross sectional views for explaining anembodiment of a method of producing the semiconductor device accordingto the present invention;

FIG. 14 is a graph for explaining the etching rates of GaAsSb and AlInAsin CCl₂ F₂ and He plasma;

FIG. 16 shows a band of GaAsSb for explaining the effects of the presentinvention; and

FIG. 17 shows a band structure of a GaAsSb/InGaAs heterojunction forexplaining the effects of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

First, a description will be given of the operating principle of asemiconductor device according to the present invention, by referring toFIGS. 3 and 4. FIG. 3 shows a semiconductor layer structure suited forforming a normal HEMT, and FIG. 4 shows a semiconductor layer structuresuited for forming an enhancement/depletion type HEMT.

The semiconductor layer structure shown in FIG. 3 includes asemi-insulative InP substrate 1, an intrinsic InGaAs channel layer 2,and an n-type GaAsSb carrier supply layer 3. On the other hand, thesemiconductor layer structure shown in FIG. 4 includes thesemi-insulative InP substrate 1, the intrinsic InGaAs channel layer 2,an n-type GaAsSb carrier supply layer 3', an n-type AlInAs etchingstopper layer 4, and an n-type GaAsSb carrier supply layer 5. Forexample, InP or InGaAs may be used in place of AlInAs for the etchingstopper layer 4. The etching stopper layer 4 enables a selective dryetching using a gas mixture of CCl₂ F₂ and He as the etching gas.

For example, the layer structures shown in FIGS. 3 and 4 are formed asfollows. That is, the channel layer 2 has a thickness of 6000 Å. Thecarrier supply layer 3 has a thickness of 300 Å and an impurity densityof 1.5×10¹⁸ cm⁻³. The carrier supply layer 3' has a thickness of 200 Åand an impurity density of 1.5×10¹⁸ cm⁻³. The etching stopper layer 4has a thickness of 20 Å and an impurity density of 1.5×10¹⁸ cm⁻³. Thecarrier supply layer 5 has a thickness of 100 Å and an impurity densityof 1.5×10¹⁸ cm⁻³.

According to the semiconductor layer structures shown in FIGS. 3 and 4,InGaAs which is used for the channel layer 2 makes a lattice matchingwith InP which is used for the substrate 1, and GaAsSb which is used forthe carrier supply layers 3, 3' and 5 make a lattice matching with InPwhich is used for the substrate 1. Furthermore, InP, AlInAs or InGaAswhich is used for the etching stopper layer 4 also makes a latticematching with InP which is used for the substrate 1. In a best mode ofthe present invention, the etching stopper layer 4 is made of InP.

Accordingly, it is possible to easily realize a semiconductor devicewhich has a satisfactory characteristic by using as the channel layer 2InGaAs which makes a lattice matching with the InP substrate 1. Inaddition, by combining with the GaAsSb carrier supply layer 3 or 3' theetching stopper layer 4 which is made of InP, InGaAs or AlInAs which islattice matched to the InP substrate 1, it is possible to easily producethe enhancement/depletion type semiconductor device.

When no lattice matching is required, it is possible to use AlInGaAs,AlGaAs, InGaP and the like for the etching stopper layer 4. In thiscase, the thickness of the etching stopper layer 4 may be 20 Å, forexample.

FIG. 5 shows an essential part of an embodiment of the semiconductordevice according to the present invention. In this embodiment, thepresent invention is applied to the enhancement/depletion type HEMT. InFIG. 5, those parts which are essentially the same as thosecorresponding parts in FIGS. 3 and 4 are designated by the samereference numerals, and a description thereof will be omitted.

The HEMT shown in FIG. 5 includes an isolation region 6, a sourceelectrode 7 of a depletion type transistor portion, a drain electrode 8of the depletion type transistor portion, a gate electrode 9 of thedepletion type transistor portion, a source electrode 10 of anenhancement type transistor portion, a drain electrode 11 of theenhancement type transistor portion, and a gate electrode 12 of theenhancement type transistor portion. The depletion type transistorportion is indicated by D, and the enhancement type transistor portionis indicated by E.

Next, a description will be given of an embodiment of a method ofproducing the semiconductor device according to the present invention,by referring to FIGS. 6 through 13 and 15. In this embodiment, it isassumed for the sake of convenience that the HEMT shown in FIG. 5 isproduced. In FIGS. 6 through 13 and 15, those parts which are the sameas those corresponding parts in FIG. 5 are designated by the samereference numerals.

In FIG. 6, metal organic chemical vapor deposition (MOCVD) techniquesare used for successively forming the intrinsic InGaAs channel layer 2,the n-type GaAsSb carrier supply layer 3,, the n-type AlInAs etchingstopper layer 4 and the n-type GaAsSb carrier supply layer 5 on thesemi-insulative InP substrate 1.

Trimethyl gallium (TMG:(CH₃)₃ Ga), trimethyl indium (TMI:(CH₃)₃ In) andarsine (AsH₃) are used for form the channel layer 2.

TMG, AsH₃ and trimethyl antimony (TMSb:(CH₃)₃ Sb) are used andmonosilane (SiH₄) is used as the dopant when forming the carrier supplylayers 3' and 5.

Trimethyl aluminum (TMA:(CH₃)₃ Al), TMI and AsH₃ are used and SiH₄ isused as the dopant when forming the etching stopper layer 4.

An ion implantation technique is used to selectively implant oxygen ionsto form the isolation region 6.

A photoresist layer 13 having openings 13A is formed on the carriersupply layer 5 using the resist process of the known photolithographytechnique. The openings 13A are formed at portions where the sourceelectrodes and the drain electrodes are to be formed at a latter stage.

Then, in FIG. 7, a vacuum deposition technique is used to successivelyform a AuGe layer having a thickness of 500 Å and a Au layer having athickness of 3000 Å, for example.

In FIG. 8, the photoresist layer 13 is removed by submerging thestructure shown in FIG. 7 into acetone, for example. As a result, theAuGe layer and the Au layer are patterned by the so-called lift offprocess, thereby forming the source electrode 7, the drain electrode 8,the source electrode 10 and the drain electrode 11.

An alloying thermal process is carried out in a nitrogen atmosphere at atemperature of approximately 450° for 5 minutes, for example.

In FIG. 9, a photoresist layer 14 having an opening 14A is formed on thecarrier supply layer 5 using the resist process of the knownphotolithography technique. The opening 14A is formed at a portion wherethe gate electrode is to be formed at a latter stage.

Then, in FIG. 10, a vacuum deposition technique is used to form an Allayer having a thickness of 3000 Å, for example.

In FIG. 11, the photoresist layer 14 is removed by submerging thestructure shown in FIG. 10 into acetone, for example. As a result, theAl layer is patterned by the so-called lift-off, thereby forming thegate electrode 9 of the depletion type HEMT.

In FIG. 12, a photoresist layer 15 having an opening 15A is formed onthe carrier supply layer 5 using the resist process of the knownphotolithography technique. The opening 15A is formed at a portion wherethe gate electrode is to be formed at a latter stage.

Then, in FIG. 13, a plasma etching step using a gas mixture of CCl₂ F₂and He as the etching gas is made to selectively etch the n-type GaAsSbcarrier supply layer 5, so that an opening 5A is formed. This opening 5Ais formed from the surface of the n-type GaAsSb carrier supply layer 5and reaches the surface of the n-type AlInAs etching stopper layer 4. Inthis case, the etching by the CCl₂ F₂ and He plasma is made forapproximately 5 seconds.

FIG. 14 shows the etching rates of GaAsSb and AlInAs when the CCl₂ F₂and He plasma is used for the etching. The ordinate indicates the timein minutes and the abscissa indicates the etching depth in Å. As isevident from FIG. 14, the etching rate of GaAsSb is 3000 Å/min while theetching rate of AlInAs is only 20 Å/min and small compared to theetching rate of GaAsSb.

Then, in FIG. 15, a vacuum deposition technique is used to form an Allayer having a thickness of 3000 Å, for example.

Next, the photoresist layer 15 is removed by submerging the structureshown in FIG. 15 into acetone, for example. As a result, the Al layer ispatterned by the so-called lift-off process, thereby forming the gateelectrode 12 of the enhancement type HEMT. Finally, the HEMT shown inFIG. 5 is produced.

FIG. 16 shows a band of GaAsSb. It may be seen that the Γ band isconsiderably lower than the L band, and no trap is generated by the DXcenter.

FIG. 17 shows a band structure of the GaAsSb/InGaAs heterojunction whenthe carrier supply layer is made of GaAsSb. The potential differencebetween the conduction bands of the GaAsSb and InGaAs layers is 0.47 eV.The potential difference between the conduction bands of the InP etchingstopper layer and the gate is 0.6 eV and there is an offset of 0.22 eV,and there is a potential difference of 0.82 eV in total. Hence, theGaAsSb carrier supply layer with an impurity density of 1.5×10¹⁸ cm⁻³need not be made extremely thin and may be in the range of 200 to 300 Å,for example, and there is no need to set the impurity density to a lowvalue. As a reuslt, the HEMT which is produced according to the presentinvention is virtually unaffected by the short-channel effect.

Further, the present invention is not limited to these embodiments, butvarious variations and modifications may be made without departing fromthe scope of the present invention.

What is claimed is:
 1. A method of producing a semiconductor devicecomprising the steps of:preparing a stacked structure having an InPsubstrate, an intrinsic channel layer formed on said InP substrate, afirst doped GaAsSb carrier supply layer formed on said intrinsic channellayer, an etching stopper layer formed on said first doped GaAsSbcarrier supply layer, and a second doped GaAsSb carrier supply layerformed on said etching stopper layer; forming an isolation region whichextends from a surface of said second doped GaAsSb carrier supply layerto said intrinsic channel layer, said isolation region isolating thesemiconductor device into first and second device regions; forming firstand second source electrodes, first and second drain electrodes and afirst gate electrode on said second doped GaAsSb carrier supply layer,said first source electrode, said first drain electrode and said firstgate electrode being formed in said first device region; selectivelyetching said second doped GaAsSb carrier supply layer to form an openingwhich extends from the surface of said second doped GaAsSb carriersupply layer to a surface of said etching stopper layer, said etchingstopper layer having an etching rate which is small compared to anetching rate of said second doped GaAsSb carrier supply layer; andforming a second gate electrode on said etching stopper layer withinsaid opening, said second source electrode, said second drain electrodeand said second gate electrode being formed in said second deviceregion.
 2. The method of producing a semiconductor device as claimed inclaim 1 wherein said step of preparing the stacked structure forms saidintrinsic channel layer from intrinsic InGaAs.
 3. The method ofproducing a semiconductor device as claimed in claim 1 wherein said stepof preparing the stacked structure forms said intrinsic channel layerwhich is lattice matched to said InP substrate and said etching stopperlayer which is lattice matched to said InP substrate.
 4. The method ofproducing a semiconductor device as claimed in claim 4 wherein said stepof preparing the stacked structure forms said etching stopper layer froma material selected from a group including doped AlInAs, doped InP anddoped InGaAs.
 5. The method of producing a semiconductor device asclaimed in claim 1 wherein said step of preparing the stacked structureforms said intrinsic channel layer which is lattice matched to said InPsubstrate and said etching stopper layer which is not lattice matched tosaid InP substrate.
 6. The method of producing a semiconductor device asclaimed in claim 5 wherein said step of preparing the stacked structureforms said etching stopper layer from a material selected from a groupincluding doped AlInGaAs, doped AlGaAs and doped InGaP.
 7. The method ofproducing a semiconductor device as claimed in claim 1 wherein said stepof selectively etching said second doped GaAsSb carrier supply layeremploys a plasma etching using a gas mixture of CCl₂ F₂ and He as anetching gas.
 8. The method of producing a semiconductor device asclaimed in claim 1 wherein said step of preparing the stacked structureuses n-type GaAsSb for said first and second doped GaAsSb carrier supplylayers and an n-type material for said etching stopper layer, said firstdevice region making up a depletion type high electron mobilitytransistor, said second device region making up an enhancement type highelectron mobility transistor.
 9. The method of producing a semiconductordevice as claimed in claim 1 wherein said step of preparing the stackedstructure forms said first and second doped GaAsSb carrier supply layersto a thickness within a range of approximately 200 to 300 Å with animpurity density of approximately 1.5×10¹⁸ cm⁻³.
 10. The method ofproducing a semiconductor device as claimed in claim 1 wherein said stepof preparing the stacked structure forms said etching stopper layer to athickness of approximately 20 Å with an impurity density ofapproximately 1.5×10¹⁸ cm⁻³.